Abstract: A phased-array CMOS receiver (RX) module operating at around 260 GHz is presented. It combines a 1D phased array fabricated on a printed circuit board (PCB) with a mechanically steered ...

Abstract: Through-silicon via (TSV) is one of the key enabling technologies of stacked 3D ICs. However, the crosstalk among the adjacent TSVs decreases the performance of TSV bus and deteriorates the ...