The final, formatted version of the article will be published soon. This study presents the first comprehensive assessment of temperature extremes across an elevation gradient in the Bavarian Alps at ...

Abstract: Nowadays, serious lateral temperature gradient across the chip surface can significantly reduce the lifetime of the power semiconductor devices. Currently, the primary methods for extracting ...

Materials Science Program, University of Rochester, Rochester, New York 14627, United States Department of Mechanical Engineering, University of Rochester, Rochester, New York 14627, United States The ...