Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...

Oregon-based TDA Systems has developed a time domain reflectometry (TDR) system to pinpoint faults in ball grid array (BGA) packages. With support from the International Sematech Assembly Analytical ...