The FPS Review on MSN

Future AMD Ryzen SoCs Could Utilize a New Overlapping Chip-Stacking Design, According to a ...

A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...
JD Supra

Drawing a Line in the Floor—Courts Are Struggling With the Overlap Between Design Patent ...

In 2003 the U.S. Supreme Court in Dastar Corp. v. Twentieth Century Fox Film Corp. emphasized that “[t]he rights of a patentee or copyright holder are part of a ‘carefully crafted bargain,’… under ...