Seoul National University's College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...

Abstract: The recent advancement of wafer bonding and monolithic integration technology offers fine-grained 3-D interconnections to face-to-face (F2F) and monolithic 3-D (M3D) ICs. In this article, we ...

Chinese scientists have made a “historic leap” in developing a chip that can cope with extreme levels of radiation. The Field-Programmable Gate Array (FPGA) chip has a wide range of potential uses, ...

Usually, CAD software products are very expensive. However, since most of the applications of such software are by companies, they can afford it. The same isn’t true for students and self-employed ...

The study benchmarks emerging integration methods and materials against industry standards, offering a clear path toward ultra-low-power, high-performance transistors that could drive the next wave of ...

State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University Shanghai 200240, P. R. China ...

A research team from Seoul National University (SNU) has outlined a roadmap for ‘gate stack’ engineering, a core technology for two-dimensional transistors. The study was published in the journal ...

Seoul National University's College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...