The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...

The unparalleled pin density and low lead inductance of ball grid arrays (BGA) are essential in today’s high pin count, high frequency integrated circuits. However, that same pin density and unique ...

FC-BGA（Flip Chip Ball Grid Array）这种被称为倒装芯片球栅格阵列的封装格式，也是目前图形加速芯片最主要的封装格式。这种封装技术始于1960年代，当时IBM为了大型计算机的组装，而开发出了所谓的C4(Controlled Collapse Chip Connection)技术，随后进一步发展成可以利用 ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...