[Correction 1/25/23: change “This product line also includes the company’s VP50 series FIPS 140-3 level 3 (pending) certified KP200 with an alphanumeric keypad, shown below.” to “This product line ...
Event spotlights next-generation memory solutions for applications such as cloud, edge devices and automotive vehicles SAN JOSE, Calif.--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader ...
The 3D memory market growth is drive by the evolving semiconductor memory landscape, focusing on advanced architectures, such as 3D NAND and 3D DRAM.Austin, Nov. 12, 2025 (GLOBE NEWSWIRE) -- 3D Memory ...
The company expects its 2025 non-GAAP operating expenses to range between $17 million and $18 million, reflecting planned investments in engineering services and headcount. Management shared their ...
Weakness in the semiconductor business is expected to continue into Q1 2025, with memory demand volatility influenced by geopolitical factors and export controls. However, AI-driven premium products ...
SAN JOSE, Calif., March 27, 2024 — At Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory module ...
April 25 (Reuters) - A group of Chinese chip companies led by Huawei Technologies and backed by the country's government aims to produce high-bandwidth memory (HBM) semiconductors, a key component in ...
Expanded DRAM and HBM output is expected to relieve infrastructure bottlenecks for hyperscalers and data centers amid rising AI demand.
Nvidia Corp. today announced the introduction of the HGX H200 computing platform, a new powerful system that features the upcoming H200 Tensor Core graphics processing unit based on its Hopper ...
SOCAMM is a new modular memory form factor exclusive to Nvidia systems Micron says SOCAMM offers high bandwidth, low power and smaller footprint SK Hynix plans production of SOCAMM as AI ...
The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory ...
Scientists want to replace electrons with so-called 'nanobubbles' — or skyrmions — to store data more densely and efficiently in advanced components that would replace RAM and flash storage. When you ...
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