Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

The technology is what is known as five-dimensional (5)D optical storage and it is one the University of Southampton team has been pursuing for a while. It was first demonstrated back in 2013, with ...

Using high-speed lasers, researchers have created "5D" data storage technology that could allow 500 TB of data to be written to a CD-sized glass disc, according to the Optica society. The technique ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Glass nanostructures etched using high-intensity femtosecond laser pulses promise to keep vast quantities of data safe for billions of years, describe Peter Kazansky, Ausra Cerkauskaite and Rokas ...

LOS ANGELES, May 19, 2020 /PRNewswire-PRWeb/ -- MedTech Breakthrough, an independent market intelligence organization that recognizes the top technology product companies in the global health and ...

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

LAS VEGAS--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem ...

MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...