Abstract: Multi-Access Edge Computing (MEC) applied to three-dimensional (3D)-Networks comprising space, air, and ground layers, bear the potential to combine benefits of all these domains and ...

Abstract: A novel wafer-level 3DIC structure named SoW-X (System-On-Wafer, eXtreme) is proposed to enable integration of up to 16 full-reticle sized ASICs, 80 HBM4 modules and 2.8K 224Gb/s long ranged ...