Rambus announces SOCAMM2, a new chipset enabling low power, high performance LPDDR5X-based memory modules for next gen AI ...
The SOCAMM2 chipset supports the emerging JEDEC Small Outline Compression Attached Memory Module (SOCAMM2) standard, which is ...
SK hynix Inc. (or "the company", announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10 ...
SK hynix Inc. said Monday it has begun mass production of a next-generation memory module designed for artificial ...
The demand for AI servers is rising quickly, with these systems expected to account for approximately 65% of the server market by 2024, according to Trendforce (2024). This growth has created an ...
How Infineon's multiphase power modules bring vertical power to power-hungry systems. Benefits and key components of the vertical power modules. Current sensing and heat monitoring features. In data ...
Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...