IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Chattanooga, Tenn. — Advanced Technical Ceramics Company offers engineers a new design guide on advanced electronic packages manufactured with co-fired multi-layer ceramic technology. Typical ...

Chip Express has raised the gate-array-density bar with the CX2000 family. The four members in the laser-programmable gate-array (LPGA) series offer 30,000 to 200,000 usable gates on a chip. All but ...