BGA(Ball Grid Array，球状矩阵排列) 是一种小型移动设备普遍采用的处理器封装方式，而现在这种技术将面对一个新的竞争对手。本周早些时候，Freescale公布了一种新的封装技术——Redistributed Chip Packaging（重分配芯片封装，RCP）。 RCP并不像插针网格阵列(Pin Grid Array ...

CAMBRIDGE, UK — Following up on the availability of Intel's Core-i7 Mobile quad-core processors, Suyin has launched a reversed pin grid array socket (rPGA-989) suitable for automatic assembly. The ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Upgrading CPUs in office computers makes a great deal of sense given that while CPU technology has advanced greatly, other components live longer lives before they become obsolete. Upgrading poses a ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

When AMD's Zen 4 processors arrive sometime next year, they're expected to use a new AM5 socket, replacing the AM4 socket used on the company's current best gaming CPU. This means the current best ...