Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It provides a practical route to high-performance electronics beyond ...

TAIPEI, Taiwan--(BUSINESS WIRE)--Fresco Logic, a global market leader that develops advanced connectivity technologies and ICs, today introduced two new product families targeting the Type-C connector ...

Eight New Products including the World's 1st USB3.1 Type-C Hub and Smallest E-Marker chip for “Smart” Cables TAIPEI, Taiwan -- May 26, 2015 --Fresco Logic, a global market leader that develops ...

Electricity doesn’t just flow freely in every direction—it needs control. That control comes from a tiny but powerful ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More AMD introduced its Spartan UltraScale+ programmable logic chips for edge ...

Application delivery platform Instart Logic today announced that it has raised a $45 million Series D round. The round was led by a new investor, the late-stage fund Geodesic Capital. Other ...