New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series SAN DIEGO, CA, UNITED STATES, January 20, 2026 ...

Previously, LPDDR SDRAM chips were mostly soldered onto the computer's mainboard and therefore could not be replaced later. The LPCAMM2 module standard changes that. Computers equipped with it can be ...