[Correction 1/25/23: change “This product line also includes the company’s VP50 series FIPS 140-3 level 3 (pending) certified KP200 with an alphanumeric keypad, shown below.” to “This product line ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory ...

The company expects its 2025 non-GAAP operating expenses to range between $17 million and $18 million, reflecting planned investments in engineering services and headcount. Management shared their ...

April 25 (Reuters) - A group of Chinese chip companies led by Huawei Technologies and backed by the country's government aims to produce high-bandwidth memory (HBM) semiconductors, a key component in ...

The 3D memory market growth is drive by the evolving semiconductor memory landscape, focusing on advanced architectures, such as 3D NAND and 3D DRAM.Austin, Nov. 12, 2025 (GLOBE NEWSWIRE) -- 3D Memory ...

Expanded DRAM and HBM output is expected to relieve infrastructure bottlenecks for hyperscalers and data centers amid rising AI demand.

Nvidia Corp. today announced the introduction of the HGX H200 computing platform, a new powerful system that features the upcoming H200 Tensor Core graphics processing unit based on its Hopper ...

The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory ...

Scientists want to replace electrons with so-called 'nanobubbles' — or skyrmions — to store data more densely and efficiently in advanced components that would replace RAM and flash storage. When you ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...