Arm的妙招是将专用的矩阵加速单元直接嵌入CPU。Arm终端事业部产品管理副总裁 James McNiven说， “它使端侧AI推理可以直接在CPU上完成，从而大幅减少数据在 CPU、NPU或GPU之间的传输延迟。” ...

正处于混沌探索期的端侧 AI 产业，迎来了一套高度确定性的底层解决方案主笔：周森审校：小炫编辑：陈述精致有料的科技报道-shenzhenware -在算力需求持续爆发的 AI 时代，计算的未来正从云端向边缘与终端深度扩展。10 月 30 日，在 ...

端侧AI的发展已接近十年时间。在2016年前后的探索期，端侧AI主要表现在算法简化与硬件适配；2018-2022年则处于技术研发期，本土创新企业开始主导产业升级；自2023年之后，随着大模型的快速发展，端侧AI也进入应用快速拓展期。在这个过程中，端侧 ...

在今年的嵌入式世界北美大会上，Acromag推出了搭载AMD（前身为Xilinx）的Zynq UltraScale+MPSoC的XMC-ZU系列模块。这些模块将四核 Arm Cortex-A53 应用 CPU 与双核 Cortex-R5 ...

Last Friday, Arm announced the newest generation of its real-time processor series, the Cortex-R82. Most people are more familiar with the Cortex A-series of CPUs, which are used as the primary ...

ARM has unveiled a set of new processors to provide the brainpower for our mobile devices to cope with advanced artificial intelligence (AI), virtual reality (VR), and mixed reality (MR) technologies.

In response to the “data explosion” caused by mobile technology, the IP development group ARM is developing their next generation of processors with energy-efficiency at the forefront of the process.

You know how sometimes technology moves so fast that a year almost feels like a lifetime ago? Well it seems that in the processor world six months is apparently a lifetime because ARM and TSMC have ...

Arm has introduced its latest CPU and GPU designs, including its flagship Cortex-X2 and Cortex-A710 CPUs and Mali-G710 GPU. The new CPU and GPU designs aren’t just Arm’s latest chip blueprints, though ...

LONDON — Processor and chip design technology licensor ARM Holdings plc has launched the Cortex-R4. the latest processor in Cortex range. ARM (Cambridge, England) previously codenamed the Cortex-R4 ...

The answer is functional safety applications. At least, that’s where TI’s ARM® Cortex™-R cores are utilized – in high performance, real-time microcontrollers. As many real-time applications are now ...

CAMBRIDGE, United Kingdom-- (BUSINESS WIRE)--ARM today announced the launch of the ARM® Cortex™-R5 MPCore™ and the Cortex-R7 MPCore processors for use in 3G and 4G mobile baseband, mass storage, ...